3d ic integration and packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption based on a course developed by its author this practical guide offers real world problem solving methods and teaches the trade offs inherent in making system level decisions explore key enabling technologies such as tsv thin wafer strength measurement and handling microsolder bumping redistribution layers . 3d ic packaging 3d ic integration 3d si integration dont use tsv use tsv technology mass production full swing production for memories volume production for mobile products y commercia lization die stacking with wire package on active applied rd is undertaken by research institutes tsv cost is the key in the phase of industrialization m aturit applied bonds package stacking pop the . A comprehensive guide to 3d ic integration and packaging technology 3d ic integration and packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Meanwhile 3d ic packaging such as stacking chips with wirebondings package on package pop chip to chip interconnects embedded passives and actives and fan out embedded wlp have been used by mobile products such as smartphones and tablets and will be the main driver for materials consumption and new materials development for the wearable products like smartwatch